Cutting and Surface Mechanical Polishing
Precise specimen cutting using a diamond saw, followed by mirror-finish mechanical polishing. The process is optimized for compatibility with AFM, SEM, synchrotron X-ray diffraction, and other advanced characterization techniques.
SEM-FIB Specimen Preparation
Utilize FIB (Focused Ion Beam) technology to prepare STEM lamellae, specially tailored for high-resolution STEM imaging with a thickness of less than 50 nm.